
Failure analysis is a systematic technical activity that targets abnormal functions, performance degradation, damage or failure of products, components or systems during intended service. It adopts scientific methods to trace root causes, clarify failure mechanisms and propose improvement schemes to prevent similar issues. Centered on answering "why failures occur, how they take place and how to avoid them", it is widely applied in electronics, semiconductors, automotive and many other industries.
It delivers prominent core values: First, resolve existing problems by quickly locating fault root causes such as burnt chips and fractured parts, shortening troubleshooting time and mitigating losses from production shutdowns and customer complaints. Second, prevent future risks. By analyzing failure mechanisms including material aging and design defects, enterprises can optimize designs and manufacturing processes to reduce failure probability at the source. Third, support quality management and R&D. Failure simulation tests can verify reliability in the R&D phase, while batch quality monitoring can be realized during mass production. It serves as a critical pillar for quality assurance and technical iteration.
Take the electronics/semiconductor industry as an example: First, confirm failure phenomena, record abnormal product behaviors and verify information such as service environment and production batches. Next, conduct non-destructive analysis for preliminary screening via visual inspection, electrical performance testing and other approaches. If further localization is required, destructive analysis including chip decapsulation and cross-section grinding shall be carried out. Afterwards, determine failure mechanisms combined with test data, and finally put forward and follow up on improvement plans.
It covers a wide range of application scenarios: In the semiconductor industry, analyzing chip failures constitutes a core technical link for relevant enterprises. In the automotive sector, troubleshooting failures of vehicle electronics and mechanical components safeguards driving safety. For medical devices, locating defects of diagnostic and implantable equipment is vital to medical safety. In judicial appraisal, analyzing failed products provides technical evidence for liability identification.
Failure analysis acts as a bridge linking fault resolution and quality improvement. It not only functions as an "emergency tool" for enterprises to tackle unexpected malfunctions, but also serves as a "technical cornerstone" driving industries toward high reliability and high safety standards.

·SAT ·2D X-Ray ·3D X-Ray: ZEISS Xradia 620 Versa
3D X-Ray:
Achieve high-resolution imaging of large-size samples at long working distances, with a maximum resolution of 0.5 μm;
Voltage range: 30KV-160KV, maximum output power: 25W;
Sample stage travel: 50mm*100mm*50mm.
1. Failure Location
InGaAs | OBIRCH | Thermal | |
Power Limitation | External power supply available | 25V/100μA, 10V/100mA | External power supply available |
Analysis Speed | Fast | Fast | Fast |
Captured Characteristic | Photon | Resistance variation after laser heating | Heat (Non-destructive testing available) |
Wavelength Range | 900nm~1700nm | N/A | 3.7μm~5.2μm |
Analysis Cases | MOSFET leakage, IC leakage (μA level) | IC short circuit, resistive leakage | IC leakage, short circuit, PCB short circuit, LU failure localization |
Hard-to-Analyze Defect Types | Metal shielding, resistive defects, non-luminous defects | Metal shielding with poor heat absorption, interference from polycrystalline resistors or bias electric field | Low power consumption and low heat generation |
2. Sample Preparation
·Polish: Perform targeted/non-targeted grinding; combined with Ion Milling to deliver clearer cross-section images.
·Decap: Applicable to gold wire, copper wire, palladium-coated copper wire, silver wire and various packages including ultra-small packages.
·Delayer: RIE employs O2, CF4, CHF3, SF6 and other plasma gases to remove materials such as Oxide, Nitride, Polyimide and Silicon. Combined with physical grinding, it achieves layer stripping for advanced chips and BSI samples.
3. SEM (Scanning Electron Microscope) / Dual Beam FIB (Dual-Beam Focused Ion Beam)
The SEM lab of HWD houses multiple brands of cold field and thermal field SEMs to meet high-resolution observation demands. Equipped with EDS for surface composition analysis of samples, and YAG detectors for sharper imaging. Multiple DB FIB systems are available for nanoscale sample preparation. The combination of cold and thermal field sources enables comprehensive data collection for customers.
4. FIB Circuit Repair
FIB circuit repair equipment: Thermo ScientificTM CENTRIOS
The circuit repair equipment supports circuit modification for aluminum process, copper process and gold process samples.
5. Nanoprober NP8000
Specifications | Functions |
100eV Detection Voltage | Effectively avoid charge accumulation, improve SEM resolution, and ensure no radiation electrical damage to advanced process devices |
DI-EBAC: Voltage-applied EBAC Function | Max beam current up to 200nA enables hotspot capture at lower magnifications to boost analysis efficiency; upgraded DI-EBAC amplifier can locate shorts below 10Ω and fully characterize current loops |
EBAC | Detect critical failures in 3D interconnect structures with resistance as low as ~100Ω |
Pulsing IV Measurement | Detect high-resistance gate phenomena |
IV Measurement: 0.1fA/0.5V Measurement Resolution | Supports measurement via 8 probes |
High & Low Temperature Testing | Recover high/low temperature faults under -50℃ ~ 150℃ |
HWD | HuaWayDa is a comprehensive third-party service institution integrating inspection, testing, metrology, certification, training and enterprise technical services. It consists of Management Center, Marketing & Customer Service Center, Laboratory, Certification Center, Management Institute, Sustainable Development Center and Enterprise Service Center, and is committed to providing customers with professional, efficient and authoritative one-stop enterprise solutions.
HWD | HuaWayDa holds CNCA approval certificate, CMA qualification, measurement standard assessment certificate, CNAS accreditation and other relevant qualifications.
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